| 摘要 |
PURPOSE:To form a low contact resistivity electrode suitable for current leads by, after the application of silver paste, preheating it at a specific temperature or below, pressing the silver using cold isostatic pressing(CIP) to bring it in tight contact with an oxide superconductor, and heating it at a specified temperature or above. CONSTITUTION:Paste silver is applied to an oxide superconductor 1. The superconductor 1 is then heated at a temperature of 700 deg.C or below at which silver particles will not grow, preferably within the range of 600-700 deg.C, to remove solvent and/or binder (preheating process). The superconductor is then pressed using CIP to bring the silver 2, 3 and 3' into tight contact with the oxide superconductor 1. Then heat treatment is preformed at a temperature of 700 deg.C or above. If the temperature exceeds 700 deg.C in the preheating process, silver particles overgrow, which will not provide good press bond. The method mentioned above provides a low contact specific resistance of 5X10<-6>OMEGA.cm<2> between an oxide superconductor and silver electrodes 2, 3 and 3'. |
