CERAMIC MULTILAYER CIRCUIT BOARD

摘要

PURPOSE:To provide a ceramic multilayer circuit board in which no poor continuity occurs at a part in which an Ag via is brought into contact with an Ag-Pd interconnection layer. CONSTITUTION:A ceramic multilayer circuit board comprises multilayer interconnection layers 2-1-2-3 provided in a ceramic body 1 and vias 3-1, 3-2 for electrically connecting the layers therebetween, wherein a thickness of the layers 2-2, 2-3 in contact with the via 3-2 is set to 10mum or less.