| 摘要 |
PURPOSE:To obtain a package of semiconductor device capable of being manufactured at extremely low cost. CONSTITUTION:Linearly arrayed through holes 11 and wiring patterns 12 concentrated from respective through holes 11 on the position for mounting a semiconductor flip chip 2 are formed on a printed-wiring substrate 1 so as to junction respective end parts 13 of the concentrated wiring patterns 12 with the terminals of the semiconductor flip chip 2 through the intermediary of a bump 21. Besides, after coating the semiconductor chip 2 with a synthetic resin 14, the printed- wiring substrate 1 is cut off as if dividing itself along almost central line of the linearly arrayed respective through holes 11 to turn the through holes 10 of the cut-off respective halves into terminals. Furthermore, respective end parts 13 of the wiring patterns 12 are connected to the terminals of the semiconductor flip chip 2 by wire-bonding step. |
