Keramische Struktur mit Kupferleiter und Verfahren zum Herstellen solcher Struktur.
摘要
The ceramic composite structure has copper based conductors being resistant to oxidation and their resistivity is maintained to a value less than about three times the resistivity of pure copper and their melting temperature is maintained to a value greater than the sintering temperature of the ceramic, with the dielectric constant of the ceramic having a value less than about 10. The conductors are composed principally of copper and additives. The method comprises: forming at least one green sheet comprised of a thermoplastic organic binder having dispersed therein particles in particular of glass, said green sheet having a sintering temperature below the melting point of said copper based conductors; forming on a surface of said first green sheet a pattern of oxidation resistant copper based conductor forming composition; superimposing a second said sheet on said surface of said first sheet; laminating said superimposed sheets together; heating said laminate in air to a burn-out temperature; and sintering said laminate in a reducing or inert atmosphere.
申请公布号
DE3851294(D1)
申请公布日期
1994.10.06
申请号
DE19883851294
申请日期
1988.10.03
申请人
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US
发明人
CHANCE, DUDLEY AUGUSTUS, NEWTON, CT 06470, US;HOUGHAM, GARETH GEOFFREY, OSSINING, NY 10562, US;GOLAND, DAVID BRIAN, BEDFORD HILLS, NY 10507, US