发明名称 Keramische Struktur mit Kupferleiter und Verfahren zum Herstellen solcher Struktur.
摘要 The ceramic composite structure has copper based conductors being resistant to oxidation and their resistivity is maintained to a value less than about three times the resistivity of pure copper and their melting temperature is maintained to a value greater than the sintering temperature of the ceramic, with the dielectric constant of the ceramic having a value less than about 10. The conductors are composed principally of copper and additives. The method comprises: forming at least one green sheet comprised of a thermoplastic organic binder having dispersed therein particles in particular of glass, said green sheet having a sintering temperature below the melting point of said copper based conductors; forming on a surface of said first green sheet a pattern of oxidation resistant copper based conductor forming composition; superimposing a second said sheet on said surface of said first sheet; laminating said superimposed sheets together; heating said laminate in air to a burn-out temperature; and sintering said laminate in a reducing or inert atmosphere.
申请公布号 DE3851294(D1) 申请公布日期 1994.10.06
申请号 DE19883851294 申请日期 1988.10.03
申请人 INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US 发明人 CHANCE, DUDLEY AUGUSTUS, NEWTON, CT 06470, US;HOUGHAM, GARETH GEOFFREY, OSSINING, NY 10562, US;GOLAND, DAVID BRIAN, BEDFORD HILLS, NY 10507, US
分类号 H05K1/09;H01L21/48;H01L23/13;H01L23/15;H01L23/498;H05K1/05;H05K3/12;H05K3/40;H05K3/44;H05K3/46;(IPC1-7):H01L23/15 主分类号 H05K1/09
代理机构 代理人
主权项
地址