Method and device for non-destructive separation of a component, which is bonded onto a circuit carrier, from said circuit carrier

摘要

A method and a device are specified by means of which it is possible to remove in a non-destructive manner a component (4) which is mounted on a circuit carrier (2) by means of an adhesive layer (3). This is achieved in that a cutting wire (23) is drawn through the adhesive layer (3) and in doing so cuts through it. <IMAGE>