Thermosetting resin compositions and their use for thin film wiring boards.

摘要

The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10<2> to 10<7> dyne/cm<2> in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.