Method and apparatus for pretreating electronic component manufacturing frame.

摘要

A method is provided for pretreating an electronic component manufacturing frame (F) which is prepared by punching. The method comprises blasting abrasive particles (S) entrained in a high speed air stream toward the frame, wherein the abrasive particles has an average diameter of no more than 200 micrometers, preferably no more than 100 micrometer, particularly no more than 50 micrometers. The abrasive particles may be advantageously made of glass.