Connections arrangement for semiconductor devices.

摘要

An arrangement for making fatigue-free external connections to a device (4,5) mounted on a direct copper bonded substrate, in which one or more connector tubes (6) are brazed to respective copper areas (2) on the substrate before the device (4,5) is mounted on the substrate, and external connections are made by soldering leads (8) or bus bars (9) into the tubes (6).