Apparatus for containing and cooling an integrated circuit device.

摘要

An apparatus (10) for containing and cooling an integrated circuit device (32), the apparatus including, a conduit (24) positioned in the chamber for transmitting a coolant (47) through the conduit. The integrated circuit (32) device is positioned in the chamber and secured to the outer surface (27) of the conduit (24). In addition, the apparatus includes an insulating member (44) positioned to provide thermal isolation between the container and the conduit.