| 摘要 |
PURPOSE:To produce semiconductor wafers that are evenly polished with reduced machining unevenness by supplying a polisher from outside and inside of a bonding plate. CONSTITUTION:A bonding plate 9, having a semiconductor wafer 6 bonded thereto, has grooves provided on its front and back sides with a hole 14 open at one end into each groove and passing through both sides of the plate, and a guide tube 15 for supplying a polisher is disposed above the front side groove to supply the polisher from inside the bonding plate. A guide tube 1 is disposed outside the bonding plate to supply the polisher from outside the bonding plate. |
