发明名称 RESIN COMPOSITION FOR IN-MOLD COATING
摘要 PURPOSE:To provide the compsn. which enables the production of a coated molded article with a coating layer excellent in glass and adhesion to the substrate of the article. CONSTITUTION:The compsn. contains an unsatd. polyester resin in an amt. of 60-90wt.% and a copolymerizable monomer in an amt. of 5-25wt.%, both based on the total resin component including a thermosetting resin and the monomer, and is used as a coating material for an in-mold coating and molding process wherein a coating layer is formed on a substrate comprising a thermosetting molding material in a mold.
申请公布号 JPH06279558(A) 申请公布日期 1994.10.04
申请号 JP19930065297 申请日期 1993.03.24
申请人 SEKISUI CHEM CO LTD 发明人 MORISHITA NATSUKI
分类号 B29C43/18;B29K101/10;B29K105/06;C08F283/01;C08F299/04;(IPC1-7):C08F299/04 主分类号 B29C43/18
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