发明名称 THERMOSETTING RESIN COMPOSITION FOR IN-MOLD COATING MOLDING AND METHOD OR IN-MOLD COATING MOLDING
摘要 PURPOSE:To provide the subject composition enabling obtaining, by in-mold coating molding process, a coated molded product excellent in the adhesion of the coating layer and maintaining sufficient such adhesion even after subjected to severe environments such as cold repetition. CONSTITUTION:The objective composition is intended that a base material consisting of a thermosetting molding material is coated, in a mold, with a thermosetting coating material to form a coating layer. In this case, one party of said thermosetting molding material and thermosetting coating material is a thermosetting resin composition comprising (A) a thermosetting resin and (B) at least one kind of compound selected from unsaturated carboxylic acids, unsaturated sulfonic acids, unsaturated phosphoric acid compounds, unsaturated isocyanates and unsaturated isothiocyanates, and the other party is a second thermosetting resin composition comprising (a) a thermosetting resin and (b) at least one kind of compound selected from unsaturated phosphoric acid compounds, polyols and polymercaptans..
申请公布号 JPH06279685(A) 申请公布日期 1994.10.04
申请号 JP19930065298 申请日期 1993.03.24
申请人 SEKISUI CHEM CO LTD 发明人 MORISHITA NATSUKI;TSUJI TOSHIMITSU
分类号 B29C43/18;B29K101/10;B29K105/06;C08L101/00;(IPC1-7):C08L101/00 主分类号 B29C43/18
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