| 摘要 |
PURPOSE:To obtain a highly reliable and high density wiring board having excellent heat-resisting property, mechanical characteristics and electric charactistics and the like at low cost by a method wherein a conductor pattern layer and an interlayer insulating film layer are alternately formed on the double-side printed wiring board, on which a conductor pad is provided, connected to the conductor of a filled-up through hole. CONSTITUTION:At least one or more layers of conductor pattern layers 701 to 708 and an interlayer insulating film layer are alternately formed on a double- side printed wiring board where a conductor pad 709, to be connected to the conductor of a filled-up interlayer connection through hole is provided. The conductor pad 709, the conductor pattern layers 701 to 708 are electrically connected with one another. For example, after the through type plated through hole of the double side printed wiring, where the surface layer conductor is patterned, and the conductor gap have been filled up by an organic high molecular insulating film, a conductor pad 709, which will be connected to the surface conductor and the through type plated through hole conductor, is formed. |
