ADAPTOR MADE OF CERAMICS, AND CERAMIC PACKAGE

摘要

PURPOSE: To provide a hexahedral ceramic package for housing a semiconductor chip which can be packaged in high density. CONSTITUTION: The ceramic package is formed of a plurality of laminated low temperature baked ceramic sheet 12. The package comprises containers 42A, 42B formed on upper and lower surfaces to contain a semiconductor chip, a connector 18B electrically connected to the chip and formed in the container, a plurality of lands 14 formed on the lower surface, and a semiconductor circuit 16 formed therein to electrically connect the connectors 18A, 18B or the connectors 18A, 18B to each other.