SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE:To dissipate heat of a semiconductor chip from both the upper and lower sides by providing a first heat sink connected to one end of a first support bar and a second heat sink connected to one end of a second support bar. CONSTITUTION:About a half of heat generated at a center of a semiconductor chip 21 is transmitted inside resin 42. When it attains to an upper heat sink 28, it quickly diffuses and is dissipated to the air from approximately an entire of an upper surface 28a of the upper heat sink 28. The remaining heat is transmitted inside a chip 21 and a silver paste layer and attains to a stage 22, diffuses into the stage 22 and is transmitted to a resin part 47. When the heat attains to a lower heat sink 29, it quickly diffuses into the lower heat sink 29 and is dissipated to the air from an approximately entire surface of a lower surface 29a of the lower heat sink 29. Heat generated in other parts is also dissipated from the upper and lower heat sinks and heat dissipation formation can be further improved.