TAB PACKAGE AND ITS CONNECTION

摘要

PURPOSE:To provide a high-packaging efficiency TAB package made to correspond to a multipin and a multichip and a method of connecting the package. CONSTITUTION:A TAB package is constituted into a structure, wherein a first resin film 5 formed with inner leads 3, wiring layers 4 and electrodes 6 and a second resin film 7 provided with opening parts 8 on the electrode parts are bonded together, the film 5 is made to bend and the fellow first resin films are bonded together with a bonding agent 9. Thereby, a high-packaging efficiency TAB package made to correspond to a multipin or a multichip is obtained.