MULTILAYER CERAMIC BOARD, ITS MANUFACTURE AND SEMICONDUCTOR PACKAGE

摘要

PURPOSE: To provide a multilayer ceramic board having high degree of freedoms of circuit design without deteriorating a transmission signal waveform. CONSTITUTION: The multilayer ceramic substrate comprises first substrate member 10 formed of a plurality of laminated low temperature baked ceramic sheets 18, and a second substrate member 20 mounted on a surface of the first member and formed of low temperature baked ceramic sheets. The substrate further comprises first and second connecting terminals 12, 14 formed on a surface of the member 10, a first conductor circuit 16 formed in and on the surface of the member 10 and electrically connecting the terminals 12, 14, a thick film resistor 24 formed on the surface of the second substrate member, and a second conductor circuit 22 formed in and on the second member and electrically connected to the circuit 16 and the resistor 24.