| 摘要 |
PURPOSE:To prevent generation of burrs and deformation of a hole, to prevent the shrinkage and positional deviation of lamination due to drying, and also to prevent oozing of a conductor when material is laminated by perforating and laminating a plastic film 1 on a ceramic green sheet 5. CONSTITUTION:A plastic film 1 is laminated on a ceramic green sheet 5, a hole 2 is formed on the green sheet 5 from the side of the film 1, a conductor 3 is filled in the hole 2 from the side of the film 1, the green sheets 5, where the film 1 is peeled off, are laminated and press-bonded, and a multilayer circuit substrate is manufactured. In that case, a plastic film 1, on which solid particles are dispersed, is used as the film 1. For example, a TiO2 particle dispersed polyethylene terephthalate plastic film 1 is laminated on the ceramic green sheet 5 using a bonding solvent, and perforated by punching. |
