| 摘要 |
PURPOSE:To obtain a glass multilayer substrate of high dimensional accuracy by a method wherein a through hole is perforated on a glass plate, a conductor is formed in the hole, and after a wiring has been provided on the surface of the glass plate, a plurality of glass wiring plates are laminated, they are integrally formed by heating, and a laminated body, generating almost no dimensional change, is formed. CONSTITUTION:A through hole 2 is provided on the prescribed part of a glass sheet 1, and a conductor 3 is formed by plating. Besides, a wiring board is formed by providing a wiring 4 on the surface of the above-mentioned glass sheet 1, a plurality of glass wiring boards are laminated and they are formed in one body by heating. For example, the wiring 4 has a moving temperature of the melting-point temperature of the single-unit metal or an alloy metal, such as copper and the like to be used for the wiring 4, or higher, and also the wiring 4 has the softening temperature of the melting-point temperature or lower of the single-unit metal or an alloy metal of copper and the like. Also, the through hole 2 forming oricess is conducted by etching or laser, and the process, with which the wiring 4 is provided and used as as a glass wiring board, is conducted by a photo-process. |
