| 摘要 |
<p>PURPOSE:To facilitate positioning, prevent variation in positions and unify high-frequency characteristics by forming grooves on the surface of a package where a transistor chip and matching circuit boards are to be mounted, and mounting them in agreement with the grooves. CONSTITUTION:A package 7 has grooves 61-66 parallel with each other, formed on its upper face, and mounting sections 71-75 between the grooves 61-66. To fabricate a semiconductor device using the package 7, a transistor chip 2 is mounted on the center mounting section 73, and matching circuit boards 3 are mounted on the remaining mounting sections 71, 72, 74 and 75. The width of the transistor chip 2 and the matching circuit boards is in accordance with that of the mounting sections 71-75 which facilitates the positioning of the chip 2 and boards 3. Suppress variation in mounting positions makes the length of wires 4 uniform and enhances the uniformity of high-frequency characteristics.</p> |
