| 摘要 |
<p>PURPOSE:To improve heat dissipation property of a multilayer lead frame by comprising a lead of a multilayer lead frame of a part which is inside approximately the same plane as a semiconductor chip and a part which bends immediately before a semiconductor chip and overlaps with an upper surface or a lower surface of a semiconductor chip. CONSTITUTION:A lead is comprised of a part which is inside approximately the same plane of a semiconductor chip 1 and a part which bends immediately before a semiconductor chip and overlaps with a lower surface of the semiconductor chip 1. A lead 4 which bends immediately before a chip and overlaps with a chip lower surface is joined to the semiconductor chip 1 through a film having polyimide electric insulation property. A heat sink 8 is also joined to an opposite side of the lead 4 through a film having polyimide electric insulation property. Heat of the chip 1 is transmitted to a lead 10a and transmitted to the lead 4 from a chip side surface. Therefore, an amount of heat dissipated through a lead frame 9 is increased and heat dissipation property can be improved.</p> |
