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发明名称
CHAMFERED SEMICONDUCTOR CHIP AND ITS CHAMFERING METHOD
摘要
申请公布号
JPH06275583(A)
申请公布日期
1994.09.30
申请号
JP19930087765
申请日期
1993.03.24
申请人
DISCO ABRASIVE SYST LTD
发明人
SEKIYA SHINJI
分类号
H01L21/301;H01L21/304;H01L21/78;(IPC1-7):H01L21/304
主分类号
H01L21/301
代理机构
代理人
主权项
地址
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