| 摘要 |
PURPOSE:To provide a method for easily manufacturing a semiconductor element mount device in which a plurality of common electrodes of the element are batch processed simultaneously. CONSTITUTION:Outer leads 21, of a lead frame 20 are fixed to through holes 12, etc., of a front surface side of a circuit board 10. A conductor board 30 is adhered through an adhesive layer 31 at an opening 11 of a rear surface side of the board as a center. The conductor plate side of the board is dipped in a solder tank, thereby connecting the frame to the board with solder raised in the hole. The plate is solder-connected to a ground electrode 10a of the rear surface of the board. That is, connection of the plate to the board is simply conducted, and a low-cost semiconductor element mount device can be provided. Since the plate is increased in contact area with the board and its thickness can be increased, a function of a heat dissipation of the conductor plate is enhanced.
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