| 摘要 |
PURPOSE:To provide the heat radiation structure of a semiconductor device, suitable for plastic packages, based on easily workable radiative fins. CONSTITUTION:A metal plate 3 is mounted on a semiconductor package 2, and coil fins 4, obtained by working a metal fine wire, are mounted thereon. Mounting metal coils, as mentioned above, increases the heat radiative area of a package surface, and facilitates the heat transfer from the coil surface to air flows and thus the cooling of the package. Since coil fins have channels open to air flow from left, right and above, they do not restrict the direction of package mounting. |
