发明名称 POST-CURING DEVICE
摘要 PURPOSE:To provide a post-curing device, which introduces intact high- temperature substrates immediately after a resin-sealing process ends therein without using a magazine and is capable of performing a post-curing treatment on the substrates, dispenses with a preheating process and is capable of contriving the improvement of productivity. CONSTITUTION:A post-curing device is provided with a substrate transfer means, such as a conveyor 15, which transfers substrates P made to go through a resin-sealing process one sheet by one sheet in a heating chamber 11 provided with a means to circulate hot air of a prescribed temperature from the entrance of the chamber 11 toward the exit of the-chamber 11.
申请公布号 JPH06275669(A) 申请公布日期 1994.09.30
申请号 JP19930062081 申请日期 1993.03.22
申请人 NIPPON SANSO KK;SHINKU RAITO:KK 发明人 SAITSU MASA;KIMOTO TAKESHI
分类号 B29C35/04;B29K101/10;H01L21/324;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C35/04
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