METHOD FOR BONDING A POROUS MEDIUM TO A SUBSTRATE

摘要

A method for bonding a porous medium (29) to the surface of a solid substrate (41) is disclosed. The method comprises positioning a dry porous medium (29) near a dry surface of a substrate (41) and impregnating the porous medium with a bonding composition by opening a valve (47) and allowing the bonding composition to pass through passageway (33) to groove (31). The impregnated porous medium (29) is maintained near the substrate surface (41) until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium (29). At least a portion of the bonding composition is flushed through the impregnated porous medium (29) towards the substrate (41) and subsequently away from the surface of the substrate by opening of valve (44) at the adaptor (42) to a vacuum source (45). The bonding composition is then evaporated at a controlled rate from the substrate (41) and the porous medium (29).