LOW-SOLVENT RESIN COMPOSITION, LOW-SOLVENT COATING COMPOSITION, AND METHOD OF COATING THEREWITH

摘要

A low-solvent resin composition comprising an oligomer having an alicyclic epoxy group in the molecule, a number-average molecular weight of 300 to 2,000, a weight-average molecular weight of 300 to 4,000 and a ratio of the weight-average molecular weight to the number-average molecular weight of 1 to 2.5; and a low-solvent coating composition comprising the above low-solvent resin composition as a binder and a cationic polymerization catalyst and having an organic solvent content of 0 to 40 % by weight. The amount of the organic solvent used can be remarkably reduced, since the coating composition comprising the low-molecular oligomer has a low viscosity, though its solid content is high. The resultant coating film is excellent in appearance and resistances to water, chipping, alkali, weather, scuff, gasoline, etc.