| 摘要 |
A method and apparatus for forming and attaching a preform to a metallic workpiece, particularly an epoxy preform for use in electronic packages. The epoxy preform is stamped from a strip and maintained in an upper die assembly. The metallic workpiece is indexed underneath the upper die assembly whereupon the epoxy preform is deposited onto the metallic workpiece and the metallic workpiece removed from underneath the upper die assembly. |
