发明名称 |
Verfahren zur kostengünstigen Herstellung einer Schicht eines ternären Verbindungshalbleiters |
摘要 |
Prodn. of a layer of a binary or ternary cpd. semiconductor, having metallic and nonmetallic components, comprises (i) vapour depositing a first discrete layer of at least one metallic component of the semiconductor onto a first flexible endless substrate; (ii) opt. vapour depositing a second layer of a second metallic component onto the first layer; (iii) producing a layer of the nonmetallic component by vapour deposition and contacting it with the metallic component layer(s); and heating to effect chemical reaction of the components to produce the cpd. semiconductor, each step being carried out continuously in a through process. A thin film solar cell arrangement has a flexible endless strip substrate which is electrically insulating at least at its surface, a first electrode layer, a photovoltaic absorber layer of a cpd. semiconductor and a second electrode layer, the electrode layers and the absorber layer being quasi-endlessly structured parallel to the strip substrate so that strip-like individual solar cells are electrically series-connected by overlapping of their electrode regions transverse to the strip substrate. ADVANTAGE - The process allows efficient mass prodn. of cpd. semiconductor layers esp. suitable for inexpensive solar cell mfr., can be automated and has high through-put rate. |
申请公布号 |
DE4225385(C2) |
申请公布日期 |
1994.09.29 |
申请号 |
DE19924225385 |
申请日期 |
1992.07.31 |
申请人 |
SIEMENS SOLAR GMBH, 80807 MUENCHEN, DE |
发明人 |
GOSLOWSKY, HANS, DIPL.-PHYS. DR., 8018 GRAFING, DE |
分类号 |
C23C14/56;C30B23/02;H01L31/0216;H01L31/0224;H01L31/0392;H01L31/18 |
主分类号 |
C23C14/56 |
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