| 摘要 |
A semiconductor laser array device includes a semiconductor laser chip array 12, each chip having a prescribed chip width, mounted on a bar-shaped supporting substrate 1, arranged parallel to the length of the substrate and position-determined in the optical axis direction of the laser chip and in the length and the height direction of the substrate. A plurality of monitor photodiode 13 and a plurality of lenses 14 with the same period as that of the laser chip array, are arranged parallel to the length of the substrate and position-determined in the optical axis direction of the laser chip and in the length and the height direction of the substrate. The laser chips, monitor photodiodes, and lenses from individual semiconductor laser devices when the array is subdivided along lines 21. The positions of the device elements are determined by projections 15, 18, 20 on the substrate 1 and the elements are soldered or adhered with polyimide adhesive to the substrate. <IMAGE> |
