发明名称 Apparatus and method for thick wafer measurement.
摘要 <p>The thickness of the entire surface of a thick semiconductor (94) layer on an insulator is determined all at once by dividing the surface into a plurality of pixels, by varying the length of a variable length optical path (110) in a Michelson interferometer (66) having an infrared source (62), illuminating the entire surface of the layer with an image of the IR source during the length variation operation, and by detecting (64) the product of the intensity (Is(z)) from the Michelson interferometer and the reflectivity R(t) of the layer as the path length is varied, such being indicative of the thickness of the layer, and by determining, for each pixel, which one of a plurality of groups of stored reflectance values, for a corresponding plurality of thicknesses, best matches the detected values, thereby providing a thickness map of the semiconductor layer. &lt;IMAGE&gt;</p>
申请公布号 EP0617255(A1) 申请公布日期 1994.09.28
申请号 EP19940302134 申请日期 1994.03.24
申请人 HUGHES AIRCRAFT COMPANY 发明人 LEDGER, ANTHONY
分类号 G01B11/06;H01L21/66;(IPC1-7):G01B11/06 主分类号 G01B11/06
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