发明名称 Tett boks for mikrokomponenter og fremgangsmåte for innkapsling i en slik boks
摘要 The sealed housing, capable of accommodating active or passive microcomponents, comprises a receptacle (10) made of thermoplastic or thermosetting material overmoulded onto output electrical contacts (14, 20) of the microcomponent (18), and a cover forming the receptacle and with it defining a cavity, containing a fluid, for accommodating the microcomponents. The material of the receptacle is also overmoulded onto a metal crown (12) and the cover (22) is of metal. It is fixed and sealed onto the crown, by soldering, brazing or even bonding. <IMAGE>
申请公布号 NO943603(D0) 申请公布日期 1994.09.28
申请号 NO19940003603 申请日期 1994.09.28
申请人 SAGEM 发明人 COINTREL JEAN-PIERRE
分类号 G01P1/02;H01L23/057;H01L23/10 主分类号 G01P1/02
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