发明名称 Solder connector device
摘要 Composite solder articles contain a first portion of a first solder having a first melting point, T1, and a second portion of a second solder having a second melting point, T2, which is at least (T1+10) DEG C. Such articles are useful as the sole solder-producing inserts in heat-recoverable solder connection devices. When the device is heated, the second solder will not melt until the first solder has melted and flowed. Thus the second solder portion can indicate when the first solder has flowed, and/or can control flow of the first solder.
申请公布号 US5350105(A) 申请公布日期 1994.09.27
申请号 US19940177640 申请日期 1994.01.05
申请人 DELALLE, JACQUES;OUANICHE, MAHREZ;LAMOTHE, MICHELE;PASSA, FREDERIC;ROUCAUTE, PHILIPPE 发明人 DELALLE, JACQUES;OUANICHE, MAHREZ;LAMOTHE, MICHELE;PASSA, FREDERIC;ROUCAUTE, PHILIPPE
分类号 B23K1/18;B23K3/00;B23K3/06;B23K35/02;H01R4/00;H01R4/72;H01R43/02;H05K1/02;H05K3/34;(IPC1-7):H01R4/72 主分类号 B23K1/18
代理机构 代理人
主权项
地址