| 摘要 |
A semiconductor device construction wherein externally drawn terminals are arranged to be easily connected externally, so that it can be applied to a module containing any of various chip sets. Terminals connected to the main electrodes of each semiconductor chip contained in an enclosing case are arranged side by side and drawn out through slots formed in the top of the case and grouped according to their polarities. Terminals with the same polarity are arranged in straight rows, while the terminal rows are arranged in parallel between groups of terminals with different polarities. |
