| 摘要 |
Halogen-free, highly filled epoxy resin casting compositions containing (a) an epoxy resin containing more than 1,2-epoxide groups in the molecule, (b) a curing agent for the epoxy resin in an amount sufficient to fully cure the epoxy resin, and (c) as the only filler, more than 50 % by weight, based on the total epoxy resin casting composition, of aluminium hydroxide of the formula Al(OH)3 with a content of total Na2O of less than 0.10 % by weight, based on the Al(OH)3, have low sensitivity to moisture and are suitable for the encapsulation of electrical or electronic components. |
