发明名称 |
Epoxy resin and adhesive composition containing the same |
摘要 |
An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
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申请公布号 |
US5350811(A) |
申请公布日期 |
1994.09.27 |
申请号 |
US19930077657 |
申请日期 |
1993.06.17 |
申请人 |
HITACHI CHEMICAL CO. LTD. |
发明人 |
ICHIMURA, NOBUO;YAMAZAKI, MITSUO;FUJITA, KOHEI;SATOU, HIDETAKA;MIYAMOTO, YASUO;KAWASUMI, MASAO;KIKUCHI, TOHRU |
分类号 |
C08G59/12;C08G59/32;H01B1/22;H01B1/24;(IPC1-7):C08F283/00 |
主分类号 |
C08G59/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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