发明名称 THERMOSETTING RESIN COMPOSITION FOR MOLDING IN-MOLD COATING AND METHOD FOR MOLDING IN-MOLD COATING
摘要 PURPOSE:To obtain a thermosetting resin composition for molding an in-mold coating capable of providing a coated molding, excellent in adhesion of a coating layer and capable of maintaining sufficient adhesion even after receiving a severe environment such as repetitive cooling and heating according to a method for molding the in-mold coating. CONSTITUTION:This thermosetting resin composition for molding an in-mold coating is used in a method for molding the in-mold coating for coating the top surface of a substrate composed of a thermosetting molding material in a mold and molding a coating layer and comprises the thermosetting molding material and a thermosetting coating material. In the composition, either thereof is a thermosetting resin composition containing a thermosetting resin and an unsaturated amine and the other is a thermosetting resin composition containing the thermosetting resin and at least a thermosetting one of unsaturated isocyanates, unsaturated isothiocyanates and unsaturated glycidyl compounds.
申请公布号 JPH06271815(A) 申请公布日期 1994.09.27
申请号 JP19930061742 申请日期 1993.03.22
申请人 SEKISUI CHEM CO LTD 发明人 MORISHITA NATSUKI
分类号 B29C43/20;B29K101/10;B29K105/06;C08L101/00;C09D201/00;(IPC1-7):C09D201/00 主分类号 B29C43/20
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