| 摘要 |
PURPOSE:To increase the number of electronic parts, which can be resin- encapsulated by a single molding process, when the electronic parts installed in hoop material is resin-encapsulation-molded and highly efficiently produce product having high quality properties and high reliability. CONSTITUTION:A plurality of molds 100, 101 and 102, 103 equipped with cavity parts 104, 106 and 108, 110, which correspond to the positions and numbers of respective electronic parts within the ranges having the prescribed lengths L of hoop material F, are arranged along the transferringly feeding direction of the hoop material F. At the same time, the respective cavity parts are arranged at the same intervals as the prescribed lengths L of the hoop material F. After that, at the prescribed positions of the respective cavity parts 104, 106 and 108, 110, pre-encapsulation electronic parts within the range of the prescribed length L of the hoop material F are successively or intermittently transferringly fed to set. At the same time, the respective pre-encapsulation electronic parts within the range of the prescribed length L of the hoop material F are simultaneously and automatically resin-encapsulation-molded continuously. |
