| 摘要 |
PURPOSE:To transfer a semiconductor wafer efficiently between a wafer boat used for, e.g. a congitudinal heat treatment device, where a plurality of ring- shaped holding members are disposed vertically, and an accommodation tool, e.g. a wafer carrier. CONSTITUTION:Two sheets of wafers W are scooped up simultaneoustly by making two sheets of forks 7A and 7B penetrate simultaneously into a carrier C, by using a transfer mechanism equipped with a plurality, for example, two sheets of forks 7A and 7B freely advancing/retreating independently. And, the upper fork 7A is forced to penetrate into a wafer boat 4, and a push-up mechanism 6 pushes up the wafer on the fork 7A, and places it on a holding member 44 after retreating the fork 7A. Next, the lower fork 7b is forced to penetrate therein, and similarly a wafer W is delivered onto the holding member 44. When the wafer is delivered form a waver boat 4 to a transfer mechanism 5, the forks are made to penetrate into wafer boats 4 in order from the lower fork.
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