| 摘要 |
PURPOSE:To provide a method f manufacturing multilayer interconnection boards which enable the formation of connecting vias for signal wires having small diameter and deep, required for multilayer interconnection boards for handling high-speed signals, are high-density ones, and handle signals of excellent quality. CONSTITUTION:This concerns a manufacturing method for a multilayer interconnection board having a board made out of ceramic, insulator layers and conductor layers formed interchangeably on the board, and a signal wiring layer for propagating electric signals to or from a power source or a grounding layer, and arranged so as to perform connection to the power source or between the upper and lower layers of signal wiring. And the title manufacture has processes of forming a part of a connecting part by plating out of a first via post 22A composed of a columnar conductor, of forming a first intermediate insulating film 13 on this first via post 22A, of forming a via hole 22B in this first insulating film 13 by etching, and of forming an intermediate signal wire 24 to be connected to this via hole 22b. |
