| 摘要 |
PURPOSE:To provide a manufacturing method for glass ceramic multilayer circuit boards which scatters organic binders in unburned boards completely, does not leave any carbon in the boards, and uses copper as conductor materials. CONSTITUTION:Concerning to the manufacture of multilayer wiring boards by green sheet lamination, copper paste having a high copper content and a low organic vehicle content is used as conductor paste, and organic binders are removed in an oxidizing atmosphere sufficient for carbon, and at a temperature enough to burn the inside organic binders thoroughly. After that, the oxidized copper is reduced back to metal copper in a nitrogen gas atmosphere containing hydrogen, and finally board materials are sintered along with copper conductors to form multilayer circuit boards. |
