PHOTOSENSITIVE SELF-ADHESIVE RESIST COMPOSITION

摘要

PURPOSE:To provide a photosensitive self-adhesive resist compsn. capable of forming a high resolution resist pattern excellent in etching resistance by a general exposure system without using a stepper and enabling easy production of a circuit element board having a large area with high productivity as a photoresist material capable of coating in a thin single layer and having function to transfer and fix a metallic mask, etc., on the surface. CONSTITUTION:This photosensitive self-adhesive resist compsn. having surface adhesiveness of a coating film sufficient to fix a mask pattern and forming a non-image part which can be removed by development and a nonsticky hardened image part by irradiation with an active light is made of a polymerizable acrylic oligomer contg. a compd. represented by the formula (where X is a residue of polyol and (n) is an integer of 2-6).