| 摘要 |
PURPOSE:To improve the heat radiating property of a semiconductor device by providing grooves for preventing the rotation of bolts in the bolt fitting sections of a heat diffusing body so that the need of silver-alloy brazing can be eliminated, the softening and deformation of the heat diffusing body can be prevented, and the heat diffusing body can be constituted of pure copper having an excellent coefficient of thermal conductivity. CONSTITUTION:In the title device in which a heat radiating fin 1 is fixed with bolts 5 to a heat diffusing body 2 to which a semiconductor chip 4 is fixed, grooves 10 are provided in the bolt fitting section of the body 2 for preventing the rotation of the bolts 5. For example, the chip 4 is fixed to the lower surface of the projecting section of the body 2 protruded downward and the electrodes of the chip 4 are wire bonded to wiring on a stepped wiring board 3 through connector wires 7. In order to fix the fin 1 to the upper surface of the body 2 with the bolts 5, in addition, bolt holes are bored through the fin 1 and body 2 and the grooves 10 are provided in the screw fitting section of the plate 2. The bolts 5 are passed through the bolt holes from the grooves 10 and the end sections of the bolts 5 protruded from the fin 1 are fastened with nuts 6. |
