METAL OR SEMICONDUCTOR SUBSTRATE TO BE MADE-UP BY APPLYING RESIST AND ITS PREPARATION

摘要

PURPOSE: To provide a metal or semiconductor substrate which is used for manufacturing a die for a micromechanical structure by deep X-ray lithography and coated with resist, and its manufacturing method. CONSTITUTION: Solution of linear organic compound having self organizing function and two terminal functional groups is spread on the surface of a substrate before resist is spread. As a result, a monomolecular layer is obtained, which acts as an adhesive layer which couples with both the substrate and the resist.