| 摘要 |
<p>PURPOSE:To always give an adequate tension to an adhesive sheet through the control with a push-up force changed as a control variable and a push-up stroke changed as an operation variable by supplying semiconductor laser chips, through feed-back control of the push-up force, from the rear surface of the adhesive sheet using suction collet. CONSTITUTION:The end part of suction collet 3 is positioned on the upper surface of a semiconductor laser chip 1 on an adhesive sheet 2 to attract the upper surface of the semiconductor laser chip 1. Next, in synchronization with positioning of the end part of the suction collet 3, a push-up needle 4 positioned at the lower surface holding the adhesive sheet 2 of the semiconductor laser chip 1 raises the semiconductor laser chip 1 from the lower side of the adhesive sheet 2. In this timing, the stroke of the push-up needle 4 is controlled for feedback amount with a mechanism consisting of a load cell 5, control unit 6 and motor 7 in view of keeping a tension given to the adhesive sheet 2 to an adequate value.</p> |
