| 摘要 |
PURPOSE:To enhance the productivity and the reliability of a bonding operation by a method wherein tape leads for a tape-carrier package are bonded to one face of a lead frame. CONSTITUTION:A first semiconductor chip 1a and a second semiconductor chip 1b in which a lead frame 4 and tape leads 3a, 3b for a tape-carrier package(TCP) have been bonded via bumps 2a 2b by an inner-lead bonding operation are held on a bonding die 8, and they are heated, pressurized and bonded collectively by a bonding tool 7. That is to say, since the tape leads 3a, 3b for the TCP are bonded to one face of the lead frame 4, they can be bonded collectively by one bonding tool 7. In addition, since the tape leads 3a, 3b as a plurality are bonded to the same face of the lead frame 4, they can be bonded stably. Thereby, the productivity and the reliability of their bonding operation are enhanced. |
