| 摘要 |
PURPOSE:To provide a semiconductor device in which the stress on connections is reduced and thus the life is prolonged by using tiny solder pins enclosing a core for the electrical and mechanical connections between a semiconductor substrate and a package substrate. CONSTITUTION:A semiconductor chip 1 has metallic terminals 5 serving as the interface to metallic cores. A package substrate 2 has metallic terminals 6 serving as the interface to tiny solder pins 3. High-melting solder 7 between the cores 4 and the terminals 5 is melted by heat to make both electrical and mechanical connections. The solder pins 3, each enclosing a core 4, are heated between the terminals 4 and 5, and they are cooled to room temperature after the cores 4 and the terminals 6 has been alloyed at the junction between them. As opposed to the conventional connection of solder pins alone, the stress on the connections is reduced, resulting in the prolongation of device life. |
