| 摘要 |
PURPOSE:To prevent deviation of wire bonding caused by expansion and compression of an ultrasonic transducer due to thermal change. CONSTITUTION:A wire bonding apparatus comprises a heater block 21 for heating and holding a semiconductor element 22, a TV camera 23, a position detecting unit 24 for processing video information, a control unit 25 for controlling position data; a transducer drive unit 29 and an ultrasonic transducer 28 provided on an XY table 26; a frequency detecting unit 34 for detecting resonance frequency of the ultrasonic transducer 28 and a processing unit 35 for compensating for a wire bonding position by computing elongation amount of the ultrasonic transducer 28 from the detected resonance frequency. Thereby, high precision wire bonding can be made even if the ultrasonic transducer 28 expands or compresses with heat. |
