发明名称 Mehrschichtiges Substrat mit Leiterbahnen.
摘要 <p>The invention concerns a multilayer wiring substract which comprises a glass ceramic section (11), a wiring layer section (13) having a plurality of wiring layers (14, 15) elctrically insulated from each other by a polyimide material, and an intermediate layer made of an inorganic material (12) and arranged between said ceramic section (11) and said wiring layer section (13). The inorganic material (12) may be an electrical insulator or a metal. The peripheral part of the ceramic section (13) are neither connected to nor in contact with each other.</p>
申请公布号 DE68915901(T2) 申请公布日期 1994.09.22
申请号 DE1989615901T 申请日期 1989.09.01
申请人 NEC CORP., TOKIO/TOKYO, JP 发明人 KIMBARA, KOHJI, TOKYO 108-01, JP
分类号 H01F17/00;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):H05K1/00 主分类号 H01F17/00
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