| 摘要 |
<p>PURPOSE:To provide a semiconductor device wherein it can obtain a sufficient heat-dissipating property and it can realize a fine pitch regarding a semiconductor chip having a structure wherein the semiconductor chip is sealed inside a resin package. CONSTITUTION:Support bars 3, for heat dissipation, which hold four corners of a die pad 2 on which a semiconductor chip 1 is mounted are formed to be wide by coupling adjacent leads 4, and their surface is exposed partly to the outside of a package 8.</p> |
